Touch sensor

ABSTRACT

A touch sensor including: a substrate including a sensing area and a non-sensing area; a touch electrode disposed on the sensing area of the substrate; a pad part disposed on the non-sensing area of the substrate; a connection line electrically connecting the touch electrode and the pad part, the connection line including a first connection line and a second connection line surrounding upper and side surfaces of the first connection line; a first insulating layer disposed on the connection line, the first insulating layer exposing at least a portion of the second connection line; and a connection electrode formed on the first insulating layer to protrude to the non-sensing area from one end of the touch electrode, the connection electrode being physically connected to the exposed second connection line through the first insulating layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2019-0018552, filed on Feb. 18, 2019, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the invention relate generally to alow-resistance touch sensor.

Discussion of the Background

A touch sensor is an input device that enables a user's command to beinput by selecting an instruction content displayed on a screen such asa display device with a user's hand or other object. The touch sensorconverts a contact position at which a user's hand or other object is incontact with the touch sensor into an electrical signal, so that aninstruction content selected at the contact position can become an inputsignal of a display device. Thus, the display device provided with thetouch sensor can be operated without any separate input device such as akeyboard or mouse.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Devices constructed according to exemplary implementations/embodimentsof the invention are capable of providing a low-resistance touch sensorthat is suitable for a large-area display device by decreasingresistance of a connection line for electrically connecting a pad partand a touch electrode of the touch sensor.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

In accordance with an exemplary embodiment of the inventive concepts,there is provided a touch sensor including: a substrate including asensing area and a non-sensing area; a touch electrode disposed on thesensing area of the substrate; a pad part disposed on the non-sensingarea of the substrate; a connection line electrically connecting thetouch electrode and the pad part, the connection line including a firstconnection line and a second connection line surrounding upper and sidesurfaces of the first connection line; a first insulating layer disposedon the connection line, the first insulating layer exposing at least aportion of the second connection line; and a connection electrode formedon the first insulating layer to protrude to the non-sensing area fromone end of the touch electrode, the connection electrode beingphysically connected to the exposed second connection line through thefirst insulating layer.

The connection line and the connection electrode may be electricallyconnected through a first contact hole exposing the second connectionline, the first contact hole being formed by removing a portion of thefirst insulating layer. The connection electrode may overlap with theconnection line with the first insulating layer interposed therebetweenin at least a partial area except the first contact hole.

The connection electrode may extend along a direction in which theconnection line extends toward the pad part, and overlap with at least aportion of the connection line.

The first connection line may have a single- or multi-layered structureincluding aluminum.

The first connection line may have a triple structure of molybdenum(Mo)/aluminum (Al)/molybdenum (Mo).

The second connection line may include an opaque conductive material ora transparent conductive material.

The connection electrode may include a transparent conductive material.

At least one of the first connection line and the second connection linemay include the same material provided on the same layer as at least aportion of the touch electrode.

The touch electrode may include: a touch electrode row having aplurality of first touch electrodes arranged along a first direction; atouch electrode column having a plurality of second touch electrodesarranged along a second direction intersecting the first direction; afirst connection pattern electrically connecting a first touch electrodeto an adjacent first touch electrode; and a second connection patternelectrically connecting a second touch electrode to an adjacent secondtouch electrode.

At least one of the first touch electrode, the second touch electrode,the first connection pattern, and the second connection pattern of thetouch electrode may include the same material provided on the same layeras at least one of the first connection line and the second connectionline, and the others of the first touch electrode, the second touchelectrode, the first connection pattern, and the second connectionpattern of the touch electrode may include the same material provided onthe same layer as the connection electrode.

In accordance with another exemplary embodiment of the inventiveconcepts, there is provided a touch sensor including: a substrateincluding a sensing area and a non-sensing area; a touch electrodedisposed on the sensing area of the substrate; a pad part disposed onthe non-sensing area of the substrate; a connection electrode extendingto the non-sensing area from one end of the touch electrode; a firstinsulating layer disposed on the connection electrode, the firstinsulating layer exposing at least a portion of the connectionelectrode; and a connection line disposed on the first insulating layer,the connection line electrically connecting the touch electrode and thepad part by being physically connected a portion of the exposedconnection electrode through the first insulating layer, the connectionline including a first connection line and a second connection linesurrounding upper and side surfaces of the first connection line.

The connection line may extend along a direction in which the connectionline extends toward the pad part, and overlap with at least a portion ofthe connection line.

The first connection line may have a single- or multi-layered structureincluding aluminum.

The first connection line may have a triple structure of molybdenum(Mo)/aluminum (Al)/molybdenum (Mo).

The second connection line may include an opaque conductive material ora transparent conductive material.

The connection electrode may include a transparent conductive material.

At least one of the first connection line and the second connection linemay include the same material provided on the same layer as at least aportion of the touch electrode.

The touch electrode may include: a touch electrode row having aplurality of first touch electrodes arranged along a first direction; atouch electrode column having a plurality of second touch electrodesarranged along a second direction intersecting the first direction; afirst connection pattern electrically connecting a first touch electrodeto an adjacent first touch electrode; and a second connection patternelectrically connecting a second touch electrode to an adjacent secondtouch electrode.

At least one of the first touch electrode, the second touch electrode,the first connection pattern, and the second connection pattern of thetouch electrode may include the same material provided on the same layeras at least one of the first connection line and the second connectionline, and the others of the first touch electrode, the second touchelectrode, the first connection pattern, and the second connectionpattern of the touch electrode may include the same material provided onthe same layer as the connection electrode.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a plan view illustrating a touch sensor in accordance with anexemplary embodiment of the inventive concepts.

FIG. 2A is a sectional view taken along line I-I′ shown in FIG. 1 inaccordance with an exemplary embodiment.

FIG. 2B is a sectional view taken along line II-IF shown in FIG. 1 inaccordance with an exemplary embodiment.

FIGS. 3A and 3B are sectional views taken along the line II-IF shown inFIG. 1 in accordance with other exemplary embodiments.

FIG. 4A is a plan view illustrating a structure of area EA shown in FIG.1.

FIG. 4B is a sectional view taken along line shown in FIG. 4A.

FIG. 5A is a plan view illustrating another structure of the area EAshown in FIG.

FIG. 5B is a sectional view taken along the line shown in FIG. 5A.

FIG. 6A is an enlarged plan view illustrating an example of portion AAshown in FIG. 1.

FIG. 6B is a sectional view taken along line IV-IV′ shown in FIG. 6A.

FIG. 7 is an enlarged plan view illustrating another example of theportion AA shown in FIG. 1.

FIG. 8A is an enlarged plan view illustrating still another example ofthe portion AA shown in FIG. 1.

FIG. 8B is a sectional view taken along the line IV-IV′ shown in FIG.8A.

FIG. 9 is an enlarged plan view illustrating still another example ofthe portion AA shown in FIG. 1.

FIG. 10A is a sectional view taken along the line I-I′ shown in FIG. 1in accordance with another exemplary embodiment.

FIG. 10B is a sectional view taken along the line II-IF shown in FIG. 1in accordance with another exemplary embodiment.

FIGS. 11A and 11B are sectional views taken along the line II-IF shownin FIG. 1 in accordance with other exemplary embodiments.

FIG. 12A is an enlarged plan view illustrating still another example ofthe portion AA shown in FIG. 1.

FIG. 12B is a sectional view taken along the line IV-IV′ shown in FIG.12A.

FIG. 13 is a graph comparing resistances of connection lines inaccordance with a conventional art connection line and an exemplaryembodiment of the inventive concepts.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a plan view illustrating a touch sensor in accordance with anexemplary embodiment of the inventive concepts. FIG. 2A is a sectionalview taken along line I-I′ shown in FIG. 1 in accordance with anexemplary embodiment. FIG. 2B is a sectional view taken along line II-IFshown in FIG. 1 in accordance with an exemplary embodiment.

As shown in FIGS. 1, 2A, and 2B, the touch sensor TSP in accordance withthe exemplary embodiment includes a base substrate SUB, a touchelectrode TE and a pad part PD, which are disposed on the base substrateSUB, and a connection line CL connecting the touch electrodes TE and thepad part PD. The connection line CL includes a first connection line CL1provided in a single layer or multi-layer and a second connection lineCL2 completely surrounding the top of the first connection line CL1.

The base substrate SUB may be formed of a transparent insulativematerial including glass, quartz, ceramic, plastic or the like. When thebase substrate SUB is made of the plastic, the base substrate SUB may beformed as a flexible substrate. For example, the base substrate SUB maybe made of an organic material selected from the group consisting ofpolyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI),polyethylene naphthalate (PEN), polyethylene terephthalate (PET),polyphenylene sulfide (PPS), polyarylate, polyimide, polycarbonate (PC),triacetate cellulose (TAC), and cellulose acetate propionate (CAP).

The base substrate SUB may include a sensing area SA in which a touch ofa user is recognized and a non-sensing area NSA in which the touch ofthe user is not recognized. Although a case where the sensing area SAand the non-sensing area NSA are provided in a quadrangular shape isillustrated in FIG. 1, the inventive concepts are not limited thereto.

The sensing area SA may overlap with a display area of a display panel(not shown) that may be disposed on one surface of the base substrateSUB. For example, the sensing area SA may have a shape corresponding tothat of the display area. In addition, the non-sensing area NSA mayoverlap with a non-display area of the display panel.

A plurality of touch electrodes TE may be provided in the sensing areaSA, and the pad part PD, connection lines CL connecting the touchelectrodes TE to the pad part PD, and the like may be provided in thenon-sensing area NSA. The pad part PD may include a plurality of padsCL_P. The pads CL_P may be electrically connected to the touchelectrodes TE through the connection lines CL, respectively.

Some of the touch electrodes TE are arranged in a first direction DR1,and touch electrodes TE arranged side by side along the first directionDR1 for each row are electrically connected to each other, to constitutea plurality of touch electrode rows formed in the shape of linesparallel to each other. The touch electrode TE included in the touchelectrode row may be a first touch electrode TE1. In addition, theothers except the first touch electrodes TE1 among the touch electrodesTE are arranged in a second direction DR2 intersecting the firstdirection DR1, and touch electrodes TE arranged side by side along thesecond direction DR2 for each column are electrically connected to eachother, to constitute a plurality of touch electrode columns formed inthe shape of lines parallel to each other. The touch electrode TEincluded in the touch electrode column may be a second touch electrodeTE2.

On each touch electrode row, a plurality of first touch electrodes TE1may be integrally formed to be connected to each other without anyseparate connection pattern, or adjacent first touch electrodes TE1 maybe electrically connected to each other through a connection pattern. Oneach touch electrode column, a plurality of second touch electrodes TE2may be integrally formed to be connected to each other without anyseparate connection pattern, or adjacent second touch electrodes TE2 maybe electrically connected to each other through a connection pattern.

Meanwhile, although a case where the first and second touch electrodesTE1 and TE2 have a rhombus shape is illustrated in FIG. 1, the shape ofthe first and second touch electrodes TE1 and TE2 is not limitedthereto. Also, at least a portion of each of the first and second touchelectrodes TE1 and TE2 may have a mesh shape having a structure in whichfine patterns intersect each other. Thus, a decrease in aperture ratioand transmissivity of a display device can be prevented or reduced bythe touch electrode TE.

The first and second touch electrodes TE1 and TE2 may be formed of atransparent conductive material such as Indium Tin Oxide (ITO) or IndiumZinc Oxide (IZO). In particular, as described above, when each of thefirst and second touch electrodes TE1 and TE2 are connected to eachother through a separate connection pattern, the connection pattern maybe formed of the above-described transparent conductive material likethe first and second touch electrodes TE1 and TE2, or be formed of anopaque conductive material selected from molybdenum (Mo), silver (Ag),titanium (Ti), copper (Cu), aluminum (Al), and the like.

Each touch electrode row and each touch electrode column may beconnected to pads CL_P through connection lines CL, respectively. One ofthe touch electrode row and the touch electrode column may be appliedwith a driving signal for touch sensing through the connection line CL,and the other of the touch electrode row and the touch electrode columnmay transfer a touch sensing signal through the connection line CL. Forexample, the touch electrode row may transfer a touch sensing signal,and the touch electrode column may be applied with a touch drivingsignal. In addition, the pad part PD is connected to an external drivingcircuit (not shown) such as a position detecting circuit, so that thetouch electrode TE and the external driving circuit can be electricallyconnected to each other.

At least a portion of the touch electrode TE protrudes to thenon-sensing area NSA to extend up to an upper surface of the connectionline CL, so that a connection electrode CE having a shape protrudingfrom the touch electrode TE can be directly connected to the connectionline CL. Although a connection electrode CE formed when the first touchelectrode TE1 extends up to the upper surface of the connection line CLsuch that a portion of the first touch electrode TE1 is connected to theconnection line CL is illustrated in FIG. 2A, the connection line CLconnected to the second touch electrode TE2 protrudes to the non-sensingarea NSA to extend up to the upper surface of the connection line CL, sothat a connection electrode CE having a shape protruding from the secondtouch electrode TE2 can be directly connected to the connection line CL.

To this end, in the non-sensing area NSA, the connection line CL isexposed by partially removing a first insulating layer IL1 disposed onthe upper surface of the connection line CL, and the second connectionline CL2 that is the exposed upper surface of the connection line CL andthe connection electrode CE may be electrically connected to each other.

The connection electrode CE protruding to the non-sensing area NSA fromeach of the first and second touch electrodes TE1 and TE2 to beconnected to each connection line CL may extend long along the lengthdirection of the connection line CL (e.g., the second direction DR2shown in FIG. 1). As shown in FIG. 2B, the connection electrode CEoverlaps with the connection line CL with the first insulating layer IL1interposed therebetween in an area around a first contact hole CH1connected to the connection line CL. The connection electrode CE mayextend up to the pad part PD along the length direction of theconnection line CL to entirely or partially overlap with the uppersurface of the connection line CL except the first contact hole CH1 withthe first insulating layer IL1 interposed therebetween.

The connection electrode CE overlaps with the upper surface of theconnection line CL, so that a defect such as a pin hole generated in thefirst insulating layer IL1 on the connection line in patterning of theconnection electrode CE can be prevented or reduced. In an embodiment,the first touch electrode TE1, the second touch electrode TE2, and theconnection electrode CE may be formed by integrally applying atransparent conductive material such as Indium Tin Oxide (ITO) or IndiumZinc Oxide (IZO) onto an upper surface of the first insulating layer IL1and then patterning the transparent conductive material, using atechnique such as etching. In the patterning of the connection electrodeCE, a portion of the first insulating layer IL1 is etched together withthe connection electrode CE, and therefore, a pin hole or the like maybe generated. Due to the pin hole, a defect may occur in the connectionline CL, or touch sensitivity may be degraded.

Thus, the connection electrode CE overlaps with the upper surface of theconnection line CL, so that etching of the first insulating layer IL1over the connection line CL can be prevented or reduced, and theoccurrence of a defect in the connection line CL can be prevented orreduced.

In an exemplary embodiment, a width of the connection electrode CEoverlapping with the connection line CL in the first direction DR1 maybe wider than that of the connection line CL in the first direction DR1.Thus, the occurrence of a defect in the connection line CL can beprevented or reduced.

Hereinafter, a structure of the connection line CL will be described indetail as follows.

The connection line CL may include a first connection line CL1 providedin a single layer or multi-layer and a second connection line CL2surrounding upper and side surfaces of the first connection line CL1.

The first connection line CL1 may be provided in a single- ormulti-layered structure formed of an opaque conductive material such asmolybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu) or aluminum(Al). The first connection line CL1 may include aluminum (Al) having lowresistance so as to achieve low resistance of the first connection lineCL1.

The second connection line CL2 may be disposed on the first connectionline CL1. The second connection line CL2 may have a structuresurrounding the upper and side surfaces of the first connection lineCL1. The second connection line CL2 caps the first connection line CL1,so that generation of a hillock of aluminum (Al) included in the firstconnection line CL1 can be prevented or reduced, and disconnection ofthe first connection line can be minimized.

The second connection line CL2 may be selected from an opaque conductivematerial such as molybdenum (Mo), silver (Ag), titanium (Ti) or copper(Cu), and a transparent conductive material such as Indium Tin Oxide(ITO) or Indium Zinc Oxide (IZO). In particular, destruction of thelow-resistance first connection line CL1 due to thermal expansion, whichis caused by the second connection line CL2, can be prevented orreduced.

FIGS. 3A and 3B are sectional views taken along the line II-IF shown inFIG. 1 in accordance with other exemplary embodiments.

As shown in FIG. 3A, the first connection line CL1 of the connectionline CL may have a structure in which a first sub-line CL1_1 and asecond sub-line CL1_2 are stacked. At least one of the first sub-lineCL1_1 and the second sub-line CL1_2 may be a metal layer includingaluminum (Al).

In addition, the second connection line CL2 may have a structuresurrounding the upper and side surfaces of the first connection lineCL1. As shown in FIG. 3B, the first connection line CL1 of theconnection line CL may have a structure in which a first sub-line CL1_1,a second sub-line CL1_2, and a third sub-line CL1_3 are stacked. Atleast one of the first sub-line CL1_1, the second sub-line CL1_2, andthe third sub-line CL1_3 may be a metal layer including aluminum (Al).

For example, the first connection line CL1 in which the first sub-lineCL1_1, the second sub-line CL1_2, and the third sub-line CL1_3 aresequentially stacked may have a structure of molybdenum (Mo)/aluminum(Al)/molybdenum (Mo). The thicknesses of molybdenum (Mo)/aluminum(Al)/molybdenum (Mo) may be 200 Å/300 Å/500 Å, respectively. Forexample, when the second connection line CL2 is provided in a singlelayer including molybdenum (Mo), the thickness of the second connectionline CL2 may be 2600 Å. For example, when the second connection line CL2includes Indium Tin Oxide (ITO), the thickness of the second connectionline CL2 may be 1350 Å.

As described above, the first connection line CL1 of the connection lineCL is to include at least one layer made of aluminum so as to achievelow resistance of the connection line CL. For example, when the firstconnection line CL1 has a single-layered structure as shown in FIG. 2A,the first connection line CL1 may be provided in a single layerincluding only aluminum or a single layer including aluminum and anothermetal. Also, when the first connection line CL has a multi-layeredstructure as shown in FIGS. 3A and 3B, the first connection line CL1 isto include at least one layer including only aluminum or includingaluminum and another metal.

Since the first connection line CL1 is formed using one mask, each metallayer may be exposed at the side surface of the first connection lineCL1. For example, when the first connection line CL1 has a structure inwhich an aluminum layer and a molybdenum layer are sequentially stacked,both aluminum and molybdenum are exposed at the side surface of thefirst connection line CL1. Thus, the second connection line CL2 isdisposed to surround not only the upper surface of the first connectionline CL1 but also the side surface of the first connection line CL1, sothat generation of a hillock of aluminum can be prevented or reduced,and disconnection of the first connection line CL1 can be minimized.

In addition, a second insulating layer IL2 may be disposed on the basesubstrate SUB to cover the connection electrode CE and the touchelectrode TE. The second insulating layer IL2 may include at least oneof an organic insulating layer including an organic material and aninorganic insulating layer including an inorganic material. For example,the second insulating layer IL2 may include at least one of siliconoxide, silicon nitride, and silicon oxynitride.

Hereinafter, a structure of the touch electrode will be described indetail as follows.

FIG. 4A is a plan view illustrating a structure of area EA shown inFIG. 1. FIG. 4B is a sectional view taken along line shown in FIG. 4A.FIG. 5A is a plan view illustrating another structure of the area EAshown in FIG. 1. FIG. 5B is a sectional view taken along the line shownin FIG. 5A.

First, as shown in FIGS. 4A and 4B, the touch electrode TE may includefirst and second touch electrodes TE1 and TE2 on the base substrate SUB.First touch electrodes TE1 disposed adjacent to each other along thefirst direction DR1 may be connected to each other through a firstconnection pattern CNP1, and second touch electrodes TE2 disposedadjacent to each other along the second direction DR2 may be connectedto each other through a second connection pattern CNP2.

Specifically, the first connection pattern CNP1 formed by patterning afirst conductive layer may be disposed on the base substrate SUB. Thefirst conductive layer may be at least one conductive layer including aconductive material. The conductive material may be selected from anopaque conductive material such as molybdenum (Mo), silver (Ag),titanium (Ti) or copper (Cu), and a transparent conductive material suchas Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO). However, theinventive concepts are not limited thereto.

The first connection pattern CNP1 is used to electrically connect firsttouch electrodes TE1 arranged side by side along the first directionDR1. The first connection pattern CNP1 may also have a shape extendingalong the first direction DR1.

In addition, a first insulating layer IL1 may be disposed on the basesubstrate SUB to cover the first connection pattern CNP1. The firstinsulating layer IL1 may include at least one of an organic insulatinglayer including an organic material and an inorganic insulating layerincluding an inorganic material. For example, the first insulating layerIL1 may include at least one of silicon oxide, silicon nitride, andsilicon oxynitride.

In addition, the first touch electrode TE1, the second touch electrode,and the second connection pattern CNP2 may be formed by allowing thefirst insulating layer IL1 to expose a portion of the first touchelectrode TE1, forming a second conductive layer on the first insulatinglayer IL1 to cover the exposed first touch electrode TE1, and thenpatterning the second conductive layer.

Like the first conductive layer, the second conductive layer may beformed in at least one layer including a conductive material. Bypatterning the second conductive layer as described above, the firsttouch electrodes TE1 arranged along the first direction DR1 to beconnected through the first connection pattern CNP and the second touchelectrodes arranged along the second direction DR2 may be formed, andthe second connection pattern CNP2 connecting adjacent second touchelectrode TE2 to each other may be formed.

In addition, the second insulating layer IL2 may be provided on thefirst insulating layer IL1 on which the first touch electrode TE1, thesecond touch electrode TE2, and the second connection pattern CNP2 areprovided. The second insulating layer IL2 prevents the first touchelectrode TE1, the second touch electrode TE2, and the second connectionpattern CNP2 from being exposed to the outside, so that corrosion of thefirst touch electrode TE1, the second touch electrode TE2, and thesecond connection pattern CNP2 can be prevented or reduced. The secondinsulating layer IL2 may include at least one of an organic insulatinglayer including an organic material and an inorganic insulating layerincluding an inorganic material.

The first touch electrode TE1, the second touch electrode TE2, and thesecond connection pattern CNP2 may be formed by patterning the firstconductive layer, and the first connection pattern CNP1 may be formed bypatterning the second conductive layer. The arrangement of the firsttouch electrode TE1, the second touch electrode TE2, the firstconnection pattern CNP1, and the second connection pattern CNP2 is notlimited thereto, and may be easily modified.

In addition, as shown in FIGS. 5A and 5B, the first connection patternCNP1 extends in an oblique direction intersecting the first directionDR1 and the second direction DR2, to connect first touch electrodes TE1arranged side by side along the first direction DR1. This is provided byconsidering visual characteristics of human beings, in which awarenesswith respect to the oblique direction is degraded as compared with thefirst direction DR1 and the second direction DR2.

When the first connection pattern CNP1 extends in the oblique directionintersecting the first direction DR1 and the second direction DR2, thefirst connection pattern CNP1 may include a first sub-connection patternCNP1_1 and a second sub-connection pattern CNP1_2.

At least two first sub-connection patterns CNP1_1 may be disposed on thebase substrate SUB to be separated from each other, to be respectivelyconnected to the first touch electrodes TE1 disposed on the firstinsulating layer IL1 through second contact holes CH2. Also, the firstsub-connection patterns CNP1_1 separated from each other may beconnected to each other through the second sub-connection pattern CNP1_2disposed in the same layer as the first touch electrode TE1, the secondtouch electrode TE2, and the second connection pattern CNP2, which areformed by patterning the second conductive layer.

As described above, a portion of the touch electrode TE is formed toprotrude up to the non-sensing area NSA, to be electrically connected tothe connection line CL.

Hereinafter, a structure between the sensing area SA and the non-sensingarea NSA of the touch sensor in which the connection line and the touchelectrode TE are connected to each other in accordance with an exemplaryembodiment will be described in detail as follows with reference to theaccompanying drawings.

FIG. 6A is an enlarged plan view illustrating an example of portion AAshown in FIG. 1. FIG. 6B is a sectional view taken along line IV-IV′shown in FIG. 6A.

As shown in FIGS. 6A and 6B, the touch electrode TE protrudes to thenon-sensing area NSA, to be electrically connected to the connectionline CL. At least one of the first connection line CL1 and the secondconnection line CL2 of the connection line CL may include the samematerial provided on the same layer as at least one of the first andsecond touch electrodes TE1 and TE2 and the first and second connectionpatterns CNP1 and CNP2 of the sensing area SA. A case where the secondconnection line CL2 is formed of the same material on the same layer asthe first connection pattern CNP1 of the sensing area SA is illustratedin the drawings. However, the inventive concepts are not limitedthereto, and the first connection pattern CNP1 may be formed of the samematerial in the same layer as at least one of the first connection lineCL1 and the second connection line CL2.

In addition, the first and second contact holes CH1 and CH2 respectivelyexposing the connection line CL and the first connection pattern CNP1may be formed by disposing the first insulating layer IL1 on the basesubstrate SUB to cover the connection line CL and the first connectionpattern CNP1 and selectively removing the first insulating layer IL1. Inaddition, the first and second touch electrodes TE1 and TE2 and thesecond connection pattern CNP2 may be disposed on the first insulatinglayer IL1. The first touch electrode TE1 may be electrically connectedto the first connection pattern CNP1 exposed by the first insulatinglayer IL1.

At the same time, the connection electrode CE formed when the firsttouch electrode TE1 extends may be disposed even in the non-sensing areaNSA to be connected to the connection line CL through the first contacthole CH1. That is, the connection electrode CE extends onto the firstinsulating layer IL1 along the length direction of the connection lineCL (e.g., the second direction DR2), so that at least a portion of theconnection electrode CE can overlap with the connection line CL with thefirst insulating layer IL1 interposed therebetween in an area except thefirst contact hole CH1.

In some exemplary embodiments, as shown in FIG. 6A, some of theconnection electrodes CE extending from the respective first touchelectrodes TE1 may have different widths on touch electrode rows. Forexample, a connection electrode CE may be formed to have an area as wideas possible within a range where it is not in contact with a connectionelectrode CE or a connection line CL on an adjacent touch electrode row.In an example, distances between adjacent connection electrodes CE maybe substantially uniform. Accordingly, first and eleventh contact holesCH1 and CH11 formed on different touch electrode rows may be located onthe same line with respect to the second direction DR2. The eleventhcontact hole CH11 may correspond to a touch electrode row different fromthat of the first contact hole CH1, and be a portion at which apredetermined connection electrode CE and a predetermined connectionline CL are physically, electrically connected to each other.

The connection lines CL may have different shapes and areas depending onconnection electrodes overlapping therewith. As a connection line CL ona touch electrode row disposed more distant from the pad part PD, theareas of portions of connection lines CL facing each other on thecorresponding touch electrode row and a touch electrode row adjacentthereto may be increased. Thus, a voltage drop, fluctuation, etc. of asignal transferred through the connection line CL can be minimized. Inaddition, the area of each of first touch electrodes TE1 disposed at anoutermost portion of the sensing area SA is increased, and thus thetouch sensitivity of an edge portion of the sensing area SA can beimproved.

In an exemplary embodiment, a width of the connection electrode CEoverlapping with the connection line CL in the first direction DR1 maybe wider than that of the connection line CL in the first direction DR1.Thus, occurrence of a defect in the connection line CL can be preventedor reduced.

FIG. 7 is an enlarged plan view illustrating another example of theportion AA shown in FIG. 1.

In FIG. 7, components identical to those described with reference toFIG. 6A are designated by like reference numerals, and their overlappingdescriptions will be omitted. In addition, a touch electrode shown inFIG. 7 may have a configuration substantially similar or identical tothat of the touch electrode shown in FIG. 6A, except the shapes ofportions of a connection line and a connection electrodes.

Referring to FIG. 7, a portion of a first touch electrode TE1, whichprotrudes to the non-sensing area NSA shown in FIG. 6, may be defined asa connection electrode CE. Also, the connection electrode CE may extendin the second direction DR2 from the protruding portion. At least aportion of the connection electrode CE may overlap with a connectionline CL.

The connection electrode may extend longer in the first direction DR1from the first touch electrode TE1 as it becomes more distant from thepad part PD. In addition, a plurality of connection electrodes CEextending in the second direction DR2 may have a substantially equalwidth.

The connection line CL may be formed to correspond to the planar shapeof the connection electrode CE. At least portions of the connection lineCL and the connection electrode CE may overlap with each other along thesecond direction DR2. Accordingly, as shown in FIG. 7, first andeleventh contact holes CH1 and CH11 are not located on the same linewith respect to the second direction DR2. For example, the distancebetween the first touch electrode TE1 and a contact hole through whichthe connection electrode CE and the connection line CL are connected toeach other corresponding to a touch electrode row in the first directionDR1 may become longer as they become more distant from the pad part PD.

As shown in FIG. 7, by the structure of the connection electrode CE andthe connection line CL, interference between adjacent conductivepatterns can be decreased, and manufacturing cost can be reduced.

In an exemplary embodiment, a width of the connection electrode CEoverlapping with the connection line CL in the first direction DR1 maybe wider than that of the connection line CL in the first direction DR1.For example, the connection electrode CE may cover (or overlap with) theentire connection line CL. Thus, occurrence of a defect in theconnection line CL can be prevented or reduced.

FIG. 8A is an enlarged plan view illustrating still another example ofthe portion AA shown in FIG. 1. FIG. 8B is a sectional view taken alongthe line IV-IV′ shown in FIG. 8A.

In FIGS. 8A and 8B, components identical to those described withreference to FIGS. 6A to 7 are designated by like reference numerals,and their overlapping descriptions will be omitted. In addition, a touchelectrode shown in FIGS. 8A and 8B may have a configurationsubstantially similar or identical to that of the touch electrode shownin FIG. 6A, except the shape of a portion of a connection electrode.

Referring to FIGS. 8A and 8B, a portion of a first touch electrode TE1,which protrudes to the non-sensing area NSA shown in FIG. 6, may bedefined as a connection electrode CE.

The connection electrode CE may electrically connect the first touchelectrode TE1 and a connection line CL. In an exemplary embodiment, theconnection electrode CE does not overlap with the connection line in anarea except a first contact hole CH1 (and an eleventh contact holeCH11). That is, the connection electrode CE does not extend in thesecond direction DR2.

At least one of a first connection line CL1 and a second connection lineCL2 of the connection line CL may include the same material provided onthe same layer as at least one of the first and second touch electrodesTE1 and TE2 and the first and second connection patterns CNP1 and CNP2of the sensing area SA.

As described above, the connection electrode CE does not extend in thesecond direction DR2, so that manufacturing cost can be reduced.

FIG. 9 is an enlarged plan view illustrating still another example ofthe portion AA shown in FIG. 1.

In FIG. 9, components identical to those described with reference toFIGS. 6A, 6B, and 8A are designated by like reference numerals, andtheir overlapping descriptions will be omitted.

Referring to FIG. 9, a portion of a first touch electrode TE1, whichprotrudes to the non-sensing area NSA shown in FIG. 6, may be defined asa connection electrode CE.

A connection line CL may be formed and disposed to having a shapesubstantially identical or similar to that of the connection line CLdescribed with reference to FIG. 8A. In addition, contact holes CH1 andCH11 respectively connected to the connection line CL and the connectionelectrode CE may be substantially located on the same line in the seconddirection DR2.

The connection electrode CE may electrically connect the first touchelectrode TE1 and the connection line CL. The connection electrode CEdoes not overlap with the connection line CL in an area except a firstcontact hole CH1 (and an eleventh contact hole CH11). That is, theconnection electrode CE does not extend in the second direction DR2. Theother configuration except the configuration of the connection electrodeCE has been described with reference to FIGS. 6A and 6B, and therefore,overlapping descriptions will be omitted.

FIG. 10A is a sectional view taken along the line I-I′ shown in FIG. 1in accordance with another exemplary embodiment. FIG. 10B is a sectionalview taken along the line II-IF shown in FIG. 1 in accordance withanother exemplary embodiment. FIGS. 11A and 11B are sectional viewstaken along the line II-IF shown in FIG. 1 in accordance with otherexemplary embodiments of the inventive concepts.

As shown in FIG. 10A, the connection line CL in accordance with theanother exemplary embodiment may extend from the touch electrode TE suchthat the connection electrode CE connected to the connection line CL isdisposed between the connection line CL and the base substrate SUB. Asshown in FIG. 10B, the connection electrode CE may extend long along thelength direction of the connection line CL such that the connectionelectrode CE and the connection line CL may be electrically connectedthrough a contact having a line shape.

That is, the connection line CL in accordance with the another exemplaryembodiment may include a first connection line CL1 having a single- ormulti-layered structure and a second connection line CL2 surroundingupper and side surfaces of the first connection line CL1, and the touchelectrode TE may extend to the non-sensing area NSA along the connectionline CL such that the connection electrode CE protruding from an end ofthe touch electrode TE is connected to the first connection line CL1.

The first connection line CL1 may be provided in a single- ormulti-layered structure formed of an opaque conductive material such asmolybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu) or aluminum(Al). The first connection line CL1 may include aluminum (Al) having lowresistance so as to achieve low resistance of the first connection lineCL1.

In addition, the second connection line CL2 may be disposed on the firstconnection line CL1. The second connection line CL2 may have a structuresurrounding the upper and side surfaces of the first connection lineCL1. The second connection line CL2 is a layer capping the firstconnection line CL1, and can prevent or reduce generation of a hillockof aluminum (Al). The second connection line CL2 may be selected from anopaque conductive material such as molybdenum (Mo), silver (Ag),titanium (Ti) or copper (Cu), and a transparent conductive material suchas Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO).

As shown in FIG. 11A, the first connection line CL1 of the connectionline CL may have a structure in which a first sub-line CL1_1 and asecond sub-line CL1_2 are stacked. Alternatively, as shown in FIG. 11B,the first connection line CL1 of the connection line CL may have astructure in which a first sub-line CL1_1, a second sub-line CL1_2, anda third sub-line CL1_3 are stacked. For example, the first connectionline CL1 in which the first sub-line CL1_1, the second sub-line CL1_2,and the third sub-line CL1_3 are sequentially stacked may have astructure of molybdenum (Mo)/aluminum (Al)/molybdenum (Mo). Thethicknesses of molybdenum (Mo)/aluminum (Al)/molybdenum (Mo) may be 200Å/300 Å/500 Å, respectively. In addition, when the second connectionline CL2 is provided in a single layer including molybdenum (Mo), thethickness of the second connection line CL2 may be 2600 Å. For example,when the second connection line CL2 includes Indium Tin Oxide (ITO), thethickness of the second connection line CL2 may be 1350 Å.

As described above, the first connection line CL1 of the connection lineCL is to include at least one layer made of aluminum so as to achievelow resistance of the connection line CL. For example, when the firstconnection line CL1 has a single-layered structure as shown in FIG. 10A,the first connection line CL1 may be provided in a single layerincluding only aluminum or a single layer including aluminum and anothermetal. Also, when the first connection line CL has a multi-layeredstructure as shown in FIGS. 11A and 11B, the first connection line CL1is to include at least one layer including only aluminum or includingaluminum and another metal.

Hereinafter, a structure between the sensing area SA and the non-sensingarea NSA of the touch sensor in which the connection line and the touchelectrode TE are connected to each other in accordance with anotherexemplary embodiment will be described in detail as follows withreference to the accompanying drawings.

FIG. 12A is an enlarged plan view illustrating still another example ofthe portion AA shown in FIG. 1. FIG. 12B is a sectional view taken alongthe line IV-IV′ shown in FIG. 12A.

As shown in FIGS. 12A and 12B, the touch electrode TE protrudes to thenon-sensing area NSA, to be electrically connected to the connectionline CL. At least one of the first connection line CL1 and the secondconnection line CL2 may be formed of the same material in the same layeras at least one of the first and second touch electrodes TE1 and TE2 andthe first and second connection patterns CNP1 and CNP2 of the sensingarea SA. A case where the first connection line CL1 is formed of thesame material in the same layer as the first connection pattern CNP1 ofthe sensing area SA is illustrated in the drawings. However, theinventive concepts are not limited thereto, and the first connectionpattern CNP1 may be formed of the same material in the same layer as atleast a portion of the first connection line CL1 and the secondconnection line CL2.

Specifically, the connection electrode CE, the first and second touchelectrodes TE1 and TE2, and the second connection pattern CNP2 may befirst disposed on the base substrate SUB. The connection electrode CE,the first and second touch electrodes TE1 and TE2, and the secondconnection pattern CNP2 may be formed of a transparent conductivematerial such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO). Theconnection electrode CE has a shape extending from the first touchelectrode TE1, and the connection electrode CE and the first touchelectrode TE1 may have an integral structure.

The first and second contact holes CH1 and CH2 respectively exposing theconnection electrode CE and the first touch electrode TE1 may be formedby disposing the first insulating layer IL1 on the base substrate SUB tocover the connection electrode CE, the first and second touch electrodesTE1 and TE2, and the second connection pattern CNP2 and selectivelyremoving the first insulating layer IL1. In addition, the firstconnection line CL1 connected to the connection electrode CE through thefirst contact hole CH1 may be disposed on the first insulating layerIL1.

The second connection line CL2 is disposed on the first connection lineCL1 to surround the upper and side surfaces of the first connection lineCL1, and the first connection pattern CNP1 is formed to corresponding tothe same material and the same layer as the second connection line CL2,so that adjacent first touch electrodes TE1 can be connected to eachother through the first connection pattern CNP1.

That is, an arrangement order of the first and second touch electrodes,the first connection pattern, and the second connection pattern inaccordance with the exemplary embodiment, which are shown in FIG. 6B,and an arrangement order of the first and second touch electrodes, thefirst connection pattern, and the second connection pattern inaccordance with the another exemplary embodiment, which are shown inFIG. 11B, may be opposite to each other with respect to the firstinsulating layer IL1. As described above, the arrangement order of thefirst and second touch electrodes, the first connection pattern, and thesecond connection pattern may be easily modified, and is not limited tothe drawings.

FIG. 13 is a graph comparing resistances of connection lines inaccordance with a conventional art and an exemplary embodiment.

As shown in FIG. 13, the resistance of the connection line provided in asingle layer made of molybdenum, which has a thickness of 2500 Å inaccordance with the conventional art, is about 0.521. However, when theconnection line in accordance with the exemplary embodiment includes afirst connection line having a structure of molybdenum (Mo)/aluminum(Al)/molybdenum (Mo) that respectively have thicknesses of 200 Å/300Å/500 Å and a second connection line provided in a single layer made ofmolybdenum (Mo), which has a thickness of 2600 Å, the resistance of theconnection line is considerably decreased as about 0.11Ω.

That is, the touch sensor in accordance with the exemplary embodiment,which includes the first connection line including aluminum having lowresistance and the second connection line surrounding upper and sidesurfaces of the first connection line, implements low resistance of theconnection line CL. Thus, the touch sensor can be applied to alarge-area display device.

In particular, although disconnection of the first connection line CL1occurs, the second connection line CL2 minimizes the disconnection, andprevents or reduces generation of a hillock of aluminum (Al) included inthe first connection line CL1, so that characteristics of the connectionline CL can be improved.

Meanwhile, the above-described touch sensor may be separatelymanufactured to be attached onto a display panel such as a liquidcrystal display panel or an organic light emitting display panel.However, an encapsulation substrate of the display panel may be the basesubstrate of the touch sensor. For example, the touch electrode, the padpart, the connection line, and the like, which are described above, maybe formed on the top of the encapsulation substrate of the displaypanel. Thus, a process of attaching the separately manufactured touchsensor to the display panel is omitted. Accordingly, processes can besimplified, manufacturing cost can be reduced, and the display devicecan be slimmed.

In accordance with the inventive concepts, resistance of the touchsensor can be decreased by decreasing resistance of the connection linefor connecting the touch electrode and the pad part.

Thus, some of the advantages that may be achieved by exemplaryembodiments of the invention include a low-resistance touch sensor thatis suitable for a large-area display device by decreasing resistance ofa connection line for electrically connecting a pad part and a touchelectrode of the touch sensor.

Although certain exemplary embodiments have been described herein, otherembodiments and modifications will be apparent from this description.Accordingly, the inventive concepts are not limited to such embodiments,but rather to the broader scope of the appended claims and variousobvious modifications and equivalent arrangements as would be apparentto a person of ordinary skill in the art.

What is claimed is:
 1. A touch sensor comprising: a substrate includinga sensing area and a non-sensing area; a touch electrode disposed on thesensing area of the substrate; a pad part disposed on the non-sensingarea of the substrate; a connection line electrically connecting thetouch electrode and the pad part, the connection line including a firstconnection line and a second connection line surrounding upper and sidesurfaces of the first connection line; a first insulating layer disposedon the connection line, the first insulating layer exposing at least aportion of the second connection line; and a connection electrode formedon the first insulating layer to protrude to the non-sensing area fromone end of the touch electrode, the connection electrode beingphysically connected to the exposed second connection line through thefirst insulating layer.
 2. The touch sensor of claim 1, wherein theconnection line and the connection electrode are electrically connectedthrough a first contact hole exposing the second connection line, thefirst contact hole being formed by removing a portion of the firstinsulating layer, and wherein the connection electrode overlaps with theconnection line with the first insulating layer interposed therebetweenin at least a partial area except the first contact hole.
 3. The touchsensor of claim 2, wherein the connection electrode extends along adirection in which the connection line extends toward the pad part, andoverlaps with at least a portion of the connection line.
 4. The touchsensor of claim 1, wherein the first connection line has a single- ormulti-layered structure including aluminum.
 5. The touch sensor of claim1, wherein the first connection line has a triple structure ofmolybdenum (Mo)/aluminum (Al)/molybdenum (Mo).
 6. The touch sensor ofclaim 1, wherein the second connection line includes an opaqueconductive material or a transparent conductive material.
 7. The touchsensor of claim 1, wherein the connection electrode includes atransparent conductive material.
 8. The touch sensor of claim 1, whereinat least one of the first connection line and the second connection lineincludes the same material provided on the same layer as at least aportion of the touch electrode.
 9. The touch sensor of claim 1, whereinthe touch electrode includes: a touch electrode row having a pluralityof first touch electrodes arranged along a first direction; a touchelectrode column having a plurality of second touch electrodes arrangedalong a second direction intersecting the first direction; a firstconnection pattern electrically connecting a first touch electrode to anadjacent first touch electrode; and a second connection patternelectrically connecting a second touch electrode to an adjacent secondtouch electrode.
 10. The touch sensor of claim 9, wherein at least oneof the first touch electrode, the second touch electrode, the firstconnection pattern, and the second connection pattern of the touchelectrode includes the same material provided on the same layer as atleast one of the first connection line and the second connection line,and a remainder of the first touch electrode, the second touchelectrode, the first connection pattern, and the second connectionpattern of the touch electrode include the same material provided on thesame layer as the connection electrode.
 11. A touch sensor comprising: asubstrate including a sensing area and a non-sensing area; a touchelectrode disposed on the sensing area of the substrate; a pad partdisposed on the non-sensing area of the substrate; a connectionelectrode extending to the non-sensing area from one end of the touchelectrode; a first insulating layer disposed on the connectionelectrode, the first insulating layer exposing at least a portion of theconnection electrode; and a connection line disposed on the firstinsulating layer, the connection line electrically connecting the touchelectrode and the pad part by being physically connected a portion ofthe exposed connection electrode through the first insulating layer, theconnection line including a first connection line and a secondconnection line surrounding upper and side surfaces of the firstconnection line.
 12. The touch sensor of claim 11, wherein theconnection electrode extends along a direction in which the connectionline extends toward the pad part, and overlaps with at least a portionof the connection line.
 13. The touch sensor of claim 11, wherein thefirst connection line has a single- or multi-layered structure includingaluminum.
 14. The touch sensor of claim 11, wherein the first connectionline has a triple structure of molybdenum (Mo)/aluminum (Al)/molybdenum(Mo).
 15. The touch sensor of claim 11, wherein the second connectionline includes an opaque conductive material or a transparent conductivematerial.
 16. The touch sensor of claim 11, wherein the connectionelectrode includes a transparent conductive material.
 17. The touchsensor of claim 11, wherein at least one of the first connection lineand the second connection line includes the same material provided onthe same layer as at least a portion of the touch electrode.
 18. Thetouch sensor of claim 11, wherein the touch electrode includes: a touchelectrode row having a plurality of first touch electrodes arrangedalong a first direction; a touch electrode column having a plurality ofsecond touch electrodes arranged along a second direction intersectingthe first direction; a first connection pattern electrically connectinga first touch electrode to an adjacent first touch electrode; and asecond connection pattern electrically connecting a second touchelectrode to an adjacent second touch electrode.
 19. The touch sensor ofclaim 18, wherein at least one of the first touch electrode, the secondtouch electrode, the first connection pattern, and the second connectionpattern of the touch electrode includes the same material provided onthe same layer as at least one of the first connection line and thesecond connection line, and a remainder of the first touch electrode,the second touch electrode, the first connection pattern, and the secondconnection pattern of the touch electrode include the same materialprovided on the same layer as the connection electrode.